Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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BGA Rework Methods and Machine

As you are aware the common method to rework BGA is : 1. Remove BGA with hot air reflow machine ( SRT as current practice) 2. Clean the BGA pad using solder iron and solder wick. 3. Replace BGA with S... (See More)

Javier Martínez
2017-05-09 22:42:07
4 answers
496 views

BGA Placement

Has anyone ever placed and reflowed a 1.27mm PBGA to 6 mil poly flex bonded to aluminum? If so what is the life expectancy of the solder joints? (See More)

michal.kozlok
2017-05-01 11:11:41
Simone Briatore
2017-03-01 11:11:41
1 answers
453 views

BGA testing - Xray

We are starting to use high count BGAs (512). Is there an industry standard on how to inspect the BGAs. Should all BGAs be inspected with Xray equipment or is there other solutions? Thank you (See More)

Benedict
2017-04-27 01:52:54
Burnell
2017-04-27 09:11:52
4 answers
468 views

Local fiducials

Hi everyone, here a question for the SMT production engineers... is possible today mount the fine pitch and ultrafine pitch devices (BGA, QFP, CSP), without using the local fiducials, but using the th... (See More)

Fabio Ricci
2017-04-23 18:17:01
babayan.grigor
2017-03-01 18:17:01
5 answers
556 views

BGA Information Needed

I am looking for some general information with respect to BGA devices on circuit boards. I work for an automation company and am curious to know who's doing what with BGA placements, specifically the ... (See More)

efem elec. co.
2017-04-21 14:51:28
William Paul
2017-04-21 16:25:10
3 answers
546 views

BGA ball seperation

I have an assembly that uses several different BGA packages. During troubleshooting we have found that some of the balls in the corners of the BGA's are separated from the underside of the package. Th... (See More)

juan
2017-04-16 09:08:37
eric.girard.1975
2017-03-01 09:08:37
1 answers
504 views

Double-Sided BGA Process

Hi All, Ok, now i have hit a brick wall with our design department and due to limited space on our standard sized boards we are going down the Double-Sided route. We have a 8 zone (4 Top/B... (See More)

Erivando Sena
2017-04-14 02:50:05
greynaga
2017-04-15 19:01:25
1 answers
503 views

To rework BGA socket

Hey All you Einsteins out there!! I gotta' problem...('course you do Steve, or you wouldn't be bugging the TechNet now would you?) I had a phone call from a acquaintance of mine wanting to bring... (See More)

tim
2017-03-01 05:41:39
Dominic
2017-03-03 05:41:39
1 answers
424 views

Problems on BGA Voiding

We are just starting to manufacture a PCB with a .039" fine-line PBGA. We are currently seeing voids, mainly in the center, that are as much as 45%. We also intermittently see the corner balls of the ... (See More)

Jorge Arizaga
2017-03-01 05:23:00
Bert
2017-03-03 05:23:00
1 answers
365 views

Anyone knows how to do BGA/CSP rework?

Hi Has anyone tried rework of lead-free assemblies? Any issues? Is there a solution for achieving high temperatures without adversely affecting board and component, considering the fact that hig... (See More)

geovannefurriel
2017-03-01 04:04:03
John Farrugia
2017-03-03 04:04:03
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