Thank you very much for your valuable suggestion! We will solve it as soon as possible!


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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Community > Groups > BGA > Anyone knows how to do BGA/CSP rework?
Anyone knows how to do BGA/CSP rework?
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Has anyone tried rework of lead-free assemblies? Any issues? Is there a solution for achieving high temperatures without adversely affecting board and component, considering the fact that higher temperatures are needed in rework machine compared to the reflow oven. I have problems such as a charred component-substrate (FR4 material) and sometimes insufficient reflow & board warpage (even with 62-mil boards). Please help me with that.
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John Farrugia

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