Thank you very much for your valuable suggestion! We will solve it as soon as possible!


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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Community > Groups > BGA > Problems on BGA Voiding
Problems on BGA Voiding
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Jorge Arizaga

We are just starting to manufacture a PCB with a .039" fine-line PBGA. We are currently seeing voids, mainly in the center, that are as much as 45%. We also intermittently see the corner balls of the PBGA smaller than the center balls. We are using a 6-mil stencil with a 1:1 aperture size (.019" mil). We are using a convection oven and reflowing in air. The solder paste is an OA 62SN36PB02AG and the reflow profile is: Preheat - 0-150 degrees C in 90 sec Soak - 150-189 degrees C for 120 sec Reflow - 189-210 degrees C for 60 sec Thermocouples were attached to both the corner and center of the PBGA and they both had the exact same profile with a max temp of 210 Degrees C. Does anyone have any recommendations for minimizing the amount of voiding? Is 45% voiding acceptable? What would explain the corner balls being smaller than the center balls?
Thank you for your input.
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