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BGA

Group Administrators: 1 | Group Member: 96 | Group Threads: 97

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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BGA Placement
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michal.kozlok

Has anyone ever placed and reflowed a 1.27mm PBGA to 6 mil poly flex bonded to aluminum? If so what is the life expectancy of the solder joints?
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Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.

el.mehdi.fakir

Your article answered all my puzzles.

Simone Briatore

This post is really interesting.

Harris.shallcross

Keep your sharing like this. You have made a nice post and I really learned a lot from you. It will help me work out my new project.

bruce_baldwin

Interesting!

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