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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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BGA Placement
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Has anyone ever placed and reflowed a 1.27mm PBGA to 6 mil poly flex bonded to aluminum? If so what is the life expectancy of the solder joints?
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Simone Briatore

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