Thank you very much for your valuable suggestion! We will solve it as soon as possible!


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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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Local fiducials
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Fabio Ricci

Hi everyone, here a question for the SMT production engineers... is possible today mount the fine pitch and ultrafine pitch devices (BGA, QFP, CSP), without using the local fiducials, but using the three standard fiducials of row card only? The correct placement precision is still assured? what is the maximum distance to put the local fiducials from the devices body allowed in a layout, to assure the placement precision?
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