Thank you very much for your valuable suggestion! We will solve it as soon as possible!


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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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BGA Information Needed
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efem elec. co.

I am looking for some general information with respect to BGA devices on circuit boards. I work for an automation company and am curious to know who's doing what with BGA placements, specifically the heat - sink application to the BGA device. Generally, are heat sinks added to the bga prior to or after assembly on to the board? How many bga devices are there typically on a board? What through-put (production) rate is typically required; i.e. boards produced per hour? I realize my questions are very general and are not specific. However, I would greatly appreciate any information possible. If you have any specific applications you'd like to discuss concerning pick and place equipment for bga devices and / or heat sink placement, please feel free to contact me.
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William Paul

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Really helpful.


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John Farrugia

Great help to my new project.

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