Thank you very much for your valuable suggestion! We will solve it as soon as possible!


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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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Double-Sided BGA Process
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Erivando Sena

Hi All,
Ok, now i have hit a brick wall with our design department and due to limited space on our standard sized boards we are going down the Double-Sided route.
We have a 8 zone (4 Top/Bottom) Quad ZCR Convection (Ok! you can stop laughing!) and i dont have any experience of this type of contruction or thermal mass.
All BGA's are plastic both top and bottom. some BGA's have one directly ont he reverse side.
Any useful direction as in what i need to do to proces this new design as now im concerned over the process, im hoping it is like doing the same with QFP's, but in reality i know its not that simple..
Can anyone help please?
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I certainly enjoyed reading your post.

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