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PCB Capability
Standard PCB Manufacturing Capability Advanced PCB Manufacturing Capability PCB Assembly Capability

Standard PCB Manufacturing Capability

Item

Standard Capability

Advanced Capability

Remark

Material

Material

Shengyi  FR-4/Kingboard CEM-1/aluminum

/


TG

Shengyi TG140°
kingboard TG>130°

 /


Heat Conductivity  for Alu.  boards

1.0

/


CTI

Class 3CTI175V

/


Specification

Surface  finish

HASL, immersion gold, OSP

/

HASL  is not acceptable for 0.4mm board

Layers

1-6

/


 Finished  Board thickness

0.6-2.0mm

0.4mm or 2.4mm

1-2  layers :0.4-2.4MM;
4layers  :0.8-2.4MM;
6layers  :1.2-2.4MM .

Thickness  Tolerance

T≥1.0mm

±10%

±8%


T<1.0mm

±0.1mm

±10%


Finished  Copper thickness

1OZ(35um)/2OZ(70um)

/

2-6  layers :1oz;2oz;
1-layer  :1oz

finished  inner copper thickness

1OZ(1.2mil)

/

Inner  copper thickness

Bow  and twist

Per cater-corner length≤0.75%

/

For  boards without SMT, the max. 1.5%

Drill

PTH deviation

±3mil

±2mil


NPTH  deviation

±2mil

±1mil


Hole Position Deviation

±3mil

/


Hole wall roughnessMax.

1.5mil

1mil


Min.  drilling bit diameter

0.3mm

 0.25mm


Max.  drilling bit diameter

6.5mm

/

For  vias  larger than 6.5mm,multiple drilling or milling is recommended

Min.  slot width

0.6mm

/

For  HASL, the min. finished slot width is 0.45mmfor other surface finish, it is 0.5mm

Board  thickness/via diameter

≤61

≤71

71≤value≥61add  one more day for fabrication

PTH deviation

width

±4mil

/


length

±5mil

/

NPTH  deviation

width

±3mil

/


length

±4mil

/

Hole  wall copper thickness

Thinnest

≥0.71mil

≥1mil


average

≥0.8mi

1mil


VIA  space (same net)

≥8mil

≥6mil


VIA  space (different net)

≥17mil

≥14mil


Min.  space for component vias  in different net

≥24mil

≥20mil


Max. PTH

Round  hole

8mm

10mm


Slot  holes

6*10mm

8*12mm


Trace

Min. trace width/space

1OZ

6/6mil

5/5mil

The  space refers to the distance between trace to trace, trace to copper

2OZ

8/8mil

7/7mil

Min.SMD  width

1OZ

≥10mil

≥8mil


2OZ

≥12mil

≥10mil

Space  between pad to trace

1OZ

8mil

6mil


2OZ

8mil

6mil

Min. etching letters

≥8mil

≥7mil


Min. space for SMD

≥10mil

/

The  data is the min. space to achieve solder mask bridge, if bridge is not  required,pls refer to the min. trace space requirement

V-Cut line to copper

 T≥1.5mmV-cut20°

20mil

16mil


T≤1.2mmV-cut 20°

16mil

12mil


Trace   width/space deviation

±20%

±15%


trace  net grids

12/12mil

8/8mil


alignment  accuracy for layer

±3mil

±2mil


Space  between trace and border

Inner layer

≥16mil

≥12mil

If  there is V-cut requirement, pls follow the V-cut standards

Outer layer

≥10mil

≥8mil

space  between via to trace

≥12mil

≥10mil


space  between inner via to trace

≥10mil

≥8mil


Solder mask

Solder  oil thickness

trace interface

0.4-0.8mil

 /


trace corner

≥0.2mil

 /

plugged  via diameter

Plugged on both sides

≤0.45mm

0.5-0.55mm

no solder  mask opening on both sides

Plumpness for plugged viasMax.

100%(≤0.4)

50%(≤0.45)

refer  to plugged depth

Space  between opening to trace/copper

≥4mil

≥3mil


opening size(single side)

≥3mil

≥2mil


text  width for solder mask opening

≥10mil

≥8mil


solder  mask bridge width

greenblue≥4milwhiteblack≥6milothers≥5mil


Silkscreen

silkscreen  width

positive text

≥6mil

5mil


negative text

≥8mil

≥6mil


silkscreen  height

≥40mil

≥30mil


space  between silkscreen to copper pad

≥7mil

6mil


the  distance between solder mask oil to copper pad

≥10mil

8mil

the min. solder mask oil strip is 5mil

space  between silkscreen to border

≥8mil

6mil


min.  silkscreen space

≥6mil

5mil


Surface finish

OSP

Min. dimension

50*50mm

/


film thickness

0.2-0.5um

/

Hot  Air Leveling

Tin thickness

2.5-30um

/

the usual tin thickness on pad is no less than 2.5um, for big tin area, it should  be no less than 1um

Immersion  gold

Gold thickness

1-2U"

/


Nickel thickness

120-200U"

/


V-CUT

Min.  dimension

80*80mm

/

only  for V-cut with one direction, the min. size is 40mm for  the side  without V-cut

Max.  dimension

500*500mm


Max.  width for manual V-cut board is 500mm, not limited for length

Min.  board thickness

0.6mm

/

No V-cut for 0.4mm board

V-CUT  angle

                20°/30°

/


alignment  accuracy for   neighbouring v-cut

±0.1mm

/


space  for two v-cut lines

≥3mm

/


space  between border to first V-cut line

≥3mm

/


remaining  board thickness after V-cut

1/3 or 1/4 of board thickness

/

 min.  remaining thickness 0.25mm

remaining  board thickness  deviation after V-cut

±0.1mm

/


Profiling

CNC  routing deviation

±0.15mm

±0.10mm


CNC the distance deviation  between via to border

±0.13mm

±0.10mm


 min.  slot width

0.8mm

/


CNC  min.via corner angle for  routing

0.4mm

/


Min.  PCB dimension

5*5mm

Min. 3mm for one side



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