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ALLPCB Advanced FPC, what makes it different?
Regular FPC ALLPCB Advanced FPC
Raw Material

Non-branded raw material

Branded raw material (Dupont, Panasonic,Shengyi, TAIFLEX, ARLON, 3M, etc.);
Halogen-free material;
Large size & stable performance material;

Drilling

Numerical control drilling

Numerical control drilling;
Laser micro drilling;

PTH

Copper plating

Copper plating;
Nanometer graphene coating;

Electroplating

Gantry style electroplate

Gantry style electroplate;
VCP continuous vertical plating;

Trace

Scattering light exposure process;
Parallel light exposure process

LDI laser exposure process;

Etching

Chemical etching

Vacuum etching

Lamination

Manual Alignment

Automatic machine film Alignment

Testing Method

2-wire flying probe testing;
2-wire in-circuit testing

4-wire flying probe testing;
4-wire in-circuit testing

Surface Finishes

Immersion Gold;
OSP

Immersion Gold;
OSP;
Electroless Nickel/Electroless Palladium/Immersion Gold;

Assembly

Manual Assembly;
Jig Assembly

Jig Assembly;
Automatic reinforcement Assembly

Printing

Silkscreen printing

High-resolution Inkjet Printing

Profile

Die Punching

High Precision Die Punching;
Laser Cut

Advanced FPC Process capability Check More