Advanced PCB Manufacturing Capability

Category	Capability	Mass batch	Small Batch	Sample Order
Base Material	Normal FR-4 Tg Value	Shengyi S1141, KB6160, Huazhen H140（not suitable for lead free process ）
	Middle FR-4 Tg Value	For HDI, multi layers: SY S1000H, ITEQIT158, HuazhengH150, TU-662,
	High FR-4 Tg Value	For thick copper, high layer: SY S1000-2, ITEQIT180A, HuazhengH170, ISOLA: FR408R, 370HR, TU-752,
	Halogen Free	Middle Tg:SY S1150G, HuazhengH150HF, H160HF. High Tg:SY S1165
	High CTI	CTI≥600V SY S1600, Huazheng H1600HF, H1600A,
	High Frequency	Rogers, Arlon, Taconic, SY SCGA-500, S7136, HuazhengH5000
	High Speed	SY S7439, TU-862HF, TU-872SLK, ISOLA: I-Speed, I-Tera@MT40, Huazheng: H175, H180, H380
	Flex Material	Base: Glue-free: Dupont AK XingyangW-type, Panosonic RF-775,
	Flex Material	Coverlay: SY SF305C, Xingyang Q-type
	Special PP	No flow PP: VT-447LF, Taiguang 370BL, Arlon 49N
		Ceramic filled adhesive sheet:Rogers4450F
		PTFE adhesive sheet:Arlon6700, Taconic FR-27/FR-28
		Double-sided coatingPI: xingyang N-1010TF-mb
	Metal Base	Berguist Al-base, Huazheng Al-base, chaosun Al-base, copperbase
	Special	High heat resistance rigidity PI: Tenghui VT-901, Arlon 85N, SY S260（Tg250） High thermal conductivity material: 92ML Pure ceramic material: alumina ceramic, Aluminum nitride ceramics BT material: Taiwan Nanya NGP-200WT
Layers	FR4	24	36	64
	Rigid&Flex /（Flex）	16（12）	20（12）	24（16）
	High Frequency Mixed Lamination	12	18	24
	100% PTFE	4	12	18
	HDI	2 steps	3 steps	4 steps
Delivery Size (mm)	Max Size (mm)	460*560	460*560	550*900
Delivery Size (mm)	Min Size (mm)	20*20	10*10	5*10
Width / Gap	Inner（mil）	0.5OZ base copper:3/3	1.0OZ base copper:4/4	2.0OZ base copper:5/6
		3.0OZ base copper:7/9	4.0OZ base copper: 8/12	5.0OZ base copper: 10/15
		6.0OZ base copper: 12/18	10 OZ base copper: 18/24	12 OZ base copper: 20/28
	Outer（mil）	1/3OZ base copper:3/3	0.5OZ base copper:4/4	1.0OZ base copper:5/5
		2.0OZ base copper:6/8	3.0OZ base copper: 7/10	4.0OZ base copper: 8/13
		5.0OZ base copper: 10/16	6.0OZ base copper: 12/18	10 OZ base copper: 18/24
		12 OZ base copper: 20/28	15 OZ base copper: 24/32
Line Width Tolerance	＞5.0 mil	±20%	±20%	±1.0mil
Line Width Tolerance	≤5.0 mil	±1.0mil	±1.0mil	±1.0mil
Copper Thickness	Inner layer（OZ）	4	6	12
Copper Thickness	Out layer（OZ）	4	6	15
Board thickness（mm）		0.5-5.0	0.4-6.5	0.4-11.5
Final Board Thickness	＞1.0 mm	±10%	±8%	±8%
Final Board Thickness	≤1.0 mm	±0.1mm	±0.1mm	±0.1mm
Board thickness/drill bit		10:01:00	12:01:00	13:01:00
Contour	Bevel edge	20-60 degree, ±5degree	20-60 degree, ±5degree	20-60 degree, ±5degree
Bow and twist		≤0.75%	≤0.75%	≤0.5%

Category	Capability	Mass batch	Small Batch	Sample Order
Drilling	Min laser （mm）	0.1	0.1	0.1
	Min CNC（mm）	0.2	0.15	0.15
	Max CNC drill bit（mm）	6.5	6.5	6.5
	Min Half Hole(mm)	0.5	0.4	0.4
	PTH Hole Normall (mm)	±0.1	±0.075	±0.075
	PTH Hole Pressing Hole(mm)	±0.05	±0.05	±0.05
	Hole Angle (conical)	Width of upper diameter≤6.5mm：800、900、1000、1100； Width of upper diameter≥6.5mm：900；
	Precision of Depth-control Drilling（mm）	±0.10	±0.075	±0.05
	Number of blind CNC holes of one side	≤2	≤3	≤4
	Minimum via hole spacing (different network, military, medical, automobile )mm	0.5	0.45	0.4
	Minimum via hole spacing (different network, general industrial control and consumer electronic ) mm	0.4	0.35	0.3
	The minimum hole wall spacing of the over hole (the same network mm)	0.2	0.2	0.15
	Minimum hole wall spacing (mm) for device holes	0.8	0.7	0.7
	The minimum distance from via hole to the inner copper or line	0.2	0.18	≤10L: 0.15
		0.2	0.18	>10L: 0.18
	The min distance from Device hole to inner copper or line	0.3	0.27	0.25
Welding Ring(mil)	Via hole	4（HDI 3mil）	3.5（HDI 3mil）	3
Welding Ring(mil)	Component hole	8	6	6
Final Board Thickness	＞1.0 mm	±10%	±8%	±8%
Final Board Thickness	≤1.0 mm	±0.1mm	±0.1mm	±0.1mm
CNC	contour tolerance（mm）	±0.15	±0.10	±0.10
	V-CUT Tolerance of residual thickness(mm)	±0.15	±0.10	±0.10
	（mm）	±0.15	±0.10	±0.10
	Routing slot（mm）	±0.15	±0.10	±0.10
	Precision of controlled deep milling（mm）	±0.15	±0.10	±0.10

Category	Capability	Mass batch	Small Batch	Sample Order
Solder Dam (mil)	（solder mask）	5	4	4
Solder Dam (mil)	（hybrid）	6	5	5

Category	Capability	Mass batch	Small Batch	Sample Order
Immersion gold	Ni thickness (micro inch)	118-236	118-236	118-236
Immersion gold	Max gold (uinch)	3	3	6
Hard gold(Au thick)	Gold finger (uinch)	15	30	60
NiPdAu	NI (uinch)	118-236
	PA (uinch)	2-5
	Au (uinch)	1-5
Graph electric gold	NI (uinch)	120-400
Graph electric gold	AU (uinch)	1-3
Immersion tin	Tin (um)	0.8-1.2
Immersion Ag	Ag (uinch)	6-10
OSP	thick (um)	0.2-0.5
HAL/HAL LF	BGApad(mm)	≥0.3×0.3
	thickness （mm）	0.6≤H≤3.0
	Board thickness vs hole diameter	Press hole≤3:1
	Tin（um）	2.0-40.0

Category	Capability	Mass batch	Small Batch	Sample Order
Special Technique		Back drilling PCB, metal sandwich, thick copper buried blind hole, step slot, disc hole, half hole, mixed lamination	Buried magnetic core PCB	Buried capacitor / resistor, embedded copper in partial area, 100% ceramic PCB, buried riveting nut PCB, embedded components PCB

Advanced PCB Capability