Brand/Specifications | Remark | |||
Material | FR-4 | Normal TG | Shengyi,Tenghui(Taiwan Brand) | |
Medium TG | Shengyi,Tenghui(Taiwan Brand) | |||
High TG | Shengyi,Tenghui(Taiwan Brand) | |||
HF | Medium TG | Shengyi | ||
High TG | Shengyi | |||
Ceramic filled high frequency board | Rogers4003/4350,Arlon25N/25FR | |||
PTFE high frequency board | Rogers series, Arlon series, Taconic series,TaiZhou Wangling | |||
Special PP | Rogers4450,Arlon25FR,Arlon 49N, Arlon6700,Taconic FR-27 | |||
Rigid PI | Arlon85N,Shengyi SH260 | |||
Metal PCB | Bergquist Alu. Domestic Alu,Copper base board | |||
Layers | FR-4 | 40-layer | ||
HDI | 24-layer | |||
Rigid-Flexible
| 16-layer | |||
High-frequency Multilayer | 24 -layer | |||
PTFE | 12-layer | |||
Metal Sandwich Board | 4-layer | |||
Trace width/space | Inner Layer | 3mil/3mil (0.5OZ base copper ) | ||
4mil/4mil (1OZ base copper) | ||||
5mil/6mil (2OZ base copper) | ||||
7mil/8mil(3OZ base copper) | ||||
8mil/10mil(4OZ base copper) | ||||
Outer Layer | 3mil/3mil(1/3OZ base copper, 0.5OZ base copper) | |||
5mil/5mil(1OZ base copper) | ||||
6mil/7mil(2OZ base copper) | ||||
7mil/8mil(3OZ base copper) | ||||
8mil/10mil(4OZ base copper) | ||||
Item | Specifications | Remark | |
Drill | Min. merchanical drilling size | 0.15mm | |
Min.laser blind drilling size | 0.10mm | ||
Ratio of thickness to via size | 12:1 | ||
Min. annular ring | 3mil | ||
Min. annular ring for component hole | 6mil | ||
Min.via space(same network) | 0.20mm | ||
Min. via space(different network) | 0.35mm | consider aboutCAF | |
Min. space for component holes | 0.70mm | ||
Inner vias to copper distance | 7mil | ||
Min. half hole | 0.4mm | ||
Via in pad or resin plugged via diameter | 0.10-0.6mm | ||
Tolerance | Via diameter tolerance | ±3mil(PTH) | |
±2mil(NPTH) | |||
±2mil(pressfit hole) | |||
Dimension tolerance | ±0.10mm | ||
Slot size tolerance | ±0.10mm | ||
Impedance control value tolerance | ±8% | ||
Board thickness tolerance | ±8%(board thickness>1.0mm) | ||
±0.10mm(board thickness≤1.0mm) | |||
Deep drilling via tolerance | ±0.10mm | ||
Trace width tolerance | ±2mil(trace width>10mil) | ||
±20%( trace width≤10mil) | |||
Item | Specifications | Remark | ||
Surface finish | Immersion gold | Max. gold thickness | 8u" | |
Hard gold | Max. gold thickness | 2.0um | ||
Immersion tin | Tin thickness | 0.8-1.2um | ||
Immersion silver | Silver thickness | 0.15-0.25um | ||
OSP | Film thickness | 0.2-0.5um | ||
Hasl with lead/Hasl lead free | Tin thickness | 2-40um | ||
Board thickness | 0.6mm≤H≤3.0mm | |||
Others | Bow and twist | 0.5% | ||
Soldermask bridge | IC space(green oil) | 7mil | ||
IC space(oil with other color) | 8mil | |||
Copper thickness | Inner layer | 12OZ | ||
Outer layer | 15OZ | |||
Drilling times for mechanical blind vias | ≤3 times | |||
Board thickness | Max. thickness | 6.8mm | ||
Min. thickness | 0.2mm(double-sided) | |||
For more special capability, please refer to your dedicated sales
2019-02-24 13:03
2019-02-24 13:03