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Panel For Example Panel For Example Panel For Example


CategoryCapabilityMass batchSmall Batch Sample Order
Base MaterialNormal FR-4 Tg ValueShengyi S1141, KB6160, Huazhen H140(not suitable for lead free process )
Middle FR-4 Tg ValueFor HDI, multi layers: SY S1000H, ITEQIT158, HuazhengH150, TU-662,
High FR-4 Tg ValueFor thick copper, high layer: SY S1000-2, ITEQIT180A, HuazhengH170, ISOLA: FR408R, 370HR, TU-752,
Halogen Free Middle Tg:SY S1150G, HuazhengH150HF, H160HF. High Tg:SY S1165
High CTICTI≥600V SY S1600, Huazheng H1600HF, H1600A,
High FrequencyRogers, Arlon, Taconic, SY SCGA-500, S7136, HuazhengH5000
High Speed SY S7439, TU-862HF, TU-872SLK, ISOLA: I-Speed, I-Tera@MT40, Huazheng: H175, H180, H380
Flex MaterialBase: Glue-free: Dupont AK XingyangW-type, Panosonic RF-775,
Coverlay: SY SF305C, Xingyang Q-type
Special PPNo flow PP: VT-447LF, Taiguang 370BL, Arlon 49N
Ceramic filled adhesive sheet:Rogers4450F
PTFE adhesive sheet:Arlon6700, Taconic FR-27/FR-28
Double-sided coatingPI: xingyang N-1010TF-mb
Metal BaseBerguist Al-base, Huazheng Al-base, chaosun Al-base, copperbase
Special High heat resistance rigidity PI: Tenghui VT-901, Arlon 85N, SY S260(Tg250) High thermal conductivity material: 92ML Pure ceramic material: alumina ceramic, Aluminum nitride ceramics BT material: Taiwan Nanya NGP-200WT
Rigid&Flex /(Flex)16(12)20(12)24(16)
High Frequency Mixed Lamination121824
100% PTFE41218
HDI2 steps3 steps4 steps
Delivery Size (mm)Max Size (mm)460*560460*560550*900
Min Size (mm)20*2010*105*10
Width / GapInner(mil)0.5OZ base copper:3/31.0OZ base copper:4/42.0OZ base copper:5/6
3.0OZ base copper:7/94.0OZ base copper: 8/125.0OZ base copper: 10/15
6.0OZ base copper: 12/1810 OZ base copper: 18/2412 OZ base copper: 20/28
Outer(mil)1/3OZ base copper:3/30.5OZ base copper:4/41.0OZ base copper:5/5
2.0OZ base copper:6/83.0OZ base copper: 7/104.0OZ base copper: 8/13
5.0OZ base copper: 10/166.0OZ base copper: 12/1810 OZ base copper: 18/24
12 OZ base copper: 20/2815 OZ base copper: 24/32
Line Width Tolerance>5.0 mil±20%±20%±1.0mil
≤5.0 mil±1.0mil±1.0mil±1.0mil
Copper ThicknessInner layer(OZ)4612
Out layer(OZ)4615
Board thickness(mm)0.5-5.00.4-6.50.4-11.5
Final Board Thickness>1.0 mm±10%±8%±8%
≤1.0 mm±0.1mm±0.1mm±0.1mm
Board thickness/drill bit10:01:0012:01:0013:01:00
ContourBevel edge20-60 degree, ±5degree20-60 degree, ±5degree20-60 degree, ±5degree
Bow and twist≤0.75%≤0.75%≤0.5%

Drilling & Hole

CategoryCapabilityMass batchSmall Batch Sample Order
DrillingMin laser (mm)
Min CNC(mm)
Max CNC drill bit(mm)
Min Half Hole(mm)
PTH Hole Normall (mm)±0.1±0.075±0.075
PTH Hole Pressing Hole(mm)±0.05±0.05±0.05
Hole Angle (conical) Width of upper diameter≤6.5mm:800、900、1000、1100; Width of upper diameter≥6.5mm:900;
Precision of Depth-control Drilling(mm)±0.10±0.075±0.05
Number of blind CNC holes of one side≤2≤3≤4
Minimum via hole spacing (different network, military, medical, automobile )mm0.50.450.4
Minimum via hole spacing (different network, general industrial control and consumer electronic ) mm0.40.350.3
The minimum hole wall spacing of the over hole (the same network mm)
Minimum hole wall spacing (mm) for device holes0.80.70.7
The minimum distance from via hole to the inner copper or line0.20.18≤10L: 0.15
>10L: 0.18
The min distance from Device hole to inner copper or line0.30.270.25
Welding Ring(mil)Via hole4(HDI 3mil)3.5(HDI 3mil)3
Component hole866
Final Board Thickness>1.0 mm±10%±8%±8%
≤1.0 mm±0.1mm±0.1mm±0.1mm
CNCcontour tolerance(mm)±0.15±0.10±0.10
V-CUT Tolerance of residual thickness(mm)±0.15±0.10±0.10
Routing slot(mm)±0.15±0.10±0.10
Precision of controlled deep milling(mm)±0.15±0.10±0.10

Solder Mask

CategoryCapabilityMass batchSmall Batch Sample Order
Solder Dam (mil)(solder mask)544

Surface Treatment

CategoryCapabilityMass batchSmall Batch Sample Order
Immersion goldNi thickness (micro inch)118-236118-236118-236
Max gold (uinch)336
Hard gold(Au thick)Gold finger (uinch)153060
NiPdAuNI (uinch)118-236
PA (uinch)2-5
Au (uinch)1-5
Graph electric goldNI (uinch)120-400
AU (uinch)1-3
Immersion tinTin (um)0.8-1.2
Immersion AgAg (uinch)6-10
OSPthick (um)0.2-0.5
HAL/HAL LFBGApad(mm)≥0.3×0.3
thickness (mm)0.6≤H≤3.0
Board thickness vs hole diameterPress hole≤3:1

Special Technique

CategoryCapabilityMass batchSmall Batch Sample Order
Special TechniqueBack drilling PCB, metal sandwich, thick copper buried blind hole, step slot, disc hole, half hole, mixed laminationBuried magnetic core PCBBuried capacitor / resistor, embedded copper in partial area, 100% ceramic PCB, buried riveting nut PCB, embedded components PCB