Base Material

FR4

Normal Tg

Shengyi S1141、KB6160、Huazhen H140（not suitable for lead free process ）

Middle Tg

For HDI、multi layers： SY S1000H、ITEQIT158、HuazhengH150; TU-662；

High Tg

For thick copper、high layer：SY S1000-2;  ITEQIT180A; HuazhengH170;ISOLA：FR408R; 370HR； TU-752；

Halogen Free

Middle Tg ：SY S1150G、HuazhengH150HF、H160HF；high Tg:  SY S1165

High CTI

CTI≥600 SY S1600、Huazheng H1600HF、H1600A；

High Frequency

Rogers、 Arlon、Taconic、SY SCGA-500、S7136; HuazhengH5000

High Speed

SY S7439；TU-862HF、TU-872SLK；ISOLA:I-Speed、I-Tera@MT40；Huazheng：H175、H180、H380

Flex Material

Base

Glue-free：Dupont AK  XingyangW-type, Panosonic RF-775；

Coverlay

SY SF305C、Xingyang Q-type

Special PP

No flow PP：       VT-447LF，Taiguang 370BL   Arlon 49N
Ceramic filled adhesive sheet:   Rogers4450F
PTFE adhesive sheet：    Arlon6700、Taconic FR-27/FR-28
Double-sided coatingPI：  xingyang N-1010TF-mb

Metal Base

Berguist Al-base 、Huazheng Al-base、chaosun Al-base、copperbase

Special

High heat resistance rigidity PI： Tenghui VT-901、Arlon 85N，SY S260（Tg250）
High thermal conductivity material：92ML
Pure ceramic material：alumina ceramic、Aluminum nitride ceramics
BT material：   Taiwan Nanya NGP-200WT

Layers

FR4

24

36

64

Rigid&Flex /（Flex）

16（12）

20（12）

24（16）

High Frequency Mixed Lamination

12

18

24

100% PTFE

4

12

18

HDI

2 steps

3 steps

4 steps

Technical Index

Mass Batch

Small Batch

Sample

Delivery Size
(mm)

Max(mm)

460*560

460*560

550*900

Min(mm)

20*20

10*10

5*10

Width / Gap

Inner（mil）

0.5OZ base copper：  3/3      1.0OZ base copper：  4/4     2.0OZ base copper：  5/6
3.0OZ base copper：  7/9      4.0OZ base copper： 8/12     5.0OZ base copper： 10/15
6.0OZ base copper： 12/18     10 OZ base copper： 18/24    12 OZ base copper： 20/28

Outer（mil）

1/3OZ base copper：  3/3     0.5OZ base copper：  4/4     1.0OZ base copper：  5/5
2.0OZ base copper：  6/8     3.0OZ base copper： 7/10     4.0OZ base copper： 8/13
5.0OZ base copper： 10/16    6.0OZ base copper： 12/18    10 OZ base copper： 18/24
12 OZ base copper： 20/28    15 OZ base copper： 24/32

Line Width Tolerance

＞5.0 mil

±20%

±20%

±1.0mil

≤5.0 mil

±1.0mil

±1.0mil

±1.0mil

Copper Thickness

Inner layer（OZ）

4

6

12

Out layer（OZ）

4

6

15

Drilling

Min laser （mm）

0.1

0.1

0.1

Min CNC（mm）

0.2

0.15

0.15

Max CNC drill bit（mm）

6.5

6.5

6.5

Min Half Hole(mm)

0.5

0.4

0.4

PTH Hole (mm)

Normal

±0.1

±0.075

±0.075

Pressing Hole

±0.05

±0.05

±0.05

Hole Angle (conical)

Width of upper diameter≤6.5mm：800、900、1000、1100；Width of upper diameter≥6.5mm：900；

Precision of Depth-control Drilling（mm）

±0.10

±0.075

±0.05

Number of blind CNC holes of one side

≤2

≤3

≤4

Minimum via hole spacing (different network, military, medical, automobile )mm

0.50

0.45

0.40

Minimum via hole spacing (different network, general industrial control and consumer electronic ) mm

0.4

0.35

0.3

Technical index

Mass batch

Small batch

sample

Drilling

The minimum hole wall spacing of the over hole (the same network mm)

0.20

0.2

0.15

Minimum hole wall spacing (mm) for device holes

0.80

0.70

0.70

The minimum distance from via hole to the inner copper or line

0.2

0.18

≤10L: 0.15
>10L: 0.18

The min distance from Device hole to inner copper or line

0.3

0.27

0.25

Welding Ring
(mil)

Via hole

4（HDI 3mil）

3.5（HDI 3mil）

3

Component hole

8

6

6

Solder Dam (mil)

（solder mask）

5

4

4

（hybrid）

6

5

5

Final Board Thickness

＞1.0 mm

±10%

±8%

±8%

≤1.0 mm

±0.1mm

±0.1mm

±0.1mm

Board thickness（mm）

0.5-5.0

0.4-6.5

0.3-11.5

Board thickness/drill bit

10:1

12:1

13:1

Via hole（drill bit）plug hole（plug solder ）

0.25-0.5mm

0.20-0.5mm

0.15-0.6mm

Blind buried hole, hole inside pad

0.25-0.5mm

0.20-0.5mm

0.10-0.6mm

Bow and twist

≤0.75%

≤0.75%

≤0.5%

Impedance Control

≥5.0mil

±10%

±10%

±8%

<5.0mil

±10%

±10%

±10%

CNC

contour tolerance（mm）

±0.15

±0.10

±0.10

V-CUT Tolerance of residual thickness(mm)
（mm）

±0.15

±0.10

±0.10

Routing slot（mm）

±0.15

±0.10

±0.10

Precision of controlled deep milling（mm）

±0.15

±0.10

±0.10

Technical index

Mass batch

Small batch

sample

Contour

Bevel edge

20～60 degree；±5degree

Surface Treatments

Immersion gold

Ni thickness
(micro inch)

118-236

118-236

118-236

Max gold (uinch)

3

3

6

Hard gold(Au thick)

Gold finger
(uinch)

15

30

60

NiPdAu

NI
(uinch)

118-236

PA
(uinch)

2-5

Au
(uinch)

1-5

Graph electric gold

NI
(uinch)

120-400

AU
(uinch)

1-3

Immersion tin

Tin
(um)

0.8-1.2

Immersion Ag

Ag
(uinch)

6-10

OSP

thick
(um)

0.2-0.5

HAL/HAL LF

BGApad(mm)

≥0.3×0.3

thickness
（mm）

0.6≤H≤3.0

Board thickness vs hole diameter

Press hole≤3:1

Tin（um）

2.0-40.0

Rigid & Flex

Maximum dielectric thickness of flex

Glue –free 25um

Glue-free 75um

Glue-free75um

Flex part width(mm)

≥10

≥5

≥2

Max delivery size (mm)

200×400

200×500

400 ×550

distance of via hole to edge of Rigid&flex(mm)

≥1.2

≥1.0

≥0.8

(mm)distance of components hole to the edge of R&F

≥1.5

≥1.2

≥1.0

Technical index

Mass batch

Small batch

sample

Rigid & Flex

Structure

The outer layer structure of the flex part, the PI reinforcement structure and the separation structure

Aluminum based rigid flex , rigid flex HDI, combination, electromagnetic shielding film

Special Tech

Back drilling PCB, metal sandwich, thick copper buried blind hole, step slot, disc hole, half hole, mixed lamination

Buried magnetic core PCB

Buried capacitor / resistor, embedded copper in partial area, 100% ceramic PCB,  buried riveting nut PCB, embedded components PCB