Advanced PCB Manufacturing Capability

Item			Brand/Specifications	Remark

Material	FR-4	Normal TG	Shengyi,Tenghui(Taiwan Brand)

		Medium TG	Shengyi,Tenghui(Taiwan Brand)

		High TG	Shengyi,Tenghui(Taiwan Brand)

	HF	Medium TG	Shengyi

		High TG	Shengyi


	Ceramic filled high frequency board		Rogers4003/4350,Arlon25N/25FR

	PTFE high frequency board		Rogers series, Arlon series, Taconic series,TaiZhou Wangling



	Special PP		Rogers4450,Arlon25FR,Arlon 49N, Arlon6700,Taconic FR-27



	Rigid PI		Arlon85N,Shengyi SH260

	Metal PCB		Bergquist Alu. Domestic Alu,Copper base board

Layers	FR-4		40-layer

	HDI		24-layer

	Rigid-Flexible		16-layer
	High-frequency Multilayer		24 -layer


	PTFE		12-layer

	Metal Sandwich Board		4-layer

Trace width/space	Inner Layer		3mil／3mil (0.5OZ base copper )

			4mil／4mil (1OZ base copper)

			5mil／6mil (2OZ base copper)

			7mil／8mil（3OZ base copper）

			8mil／10mil（4OZ base copper）

	Outer Layer		3mil／3mil（1/3OZ base copper, 0.5OZ base copper）


			5mil／5mil（1OZ base copper）

			6mil／7mil（2OZ base copper）


			7mil／8mil（3OZ base copper）

			8mil／10mil（4OZ base copper）

Item		Specifications	Remark
Drill	Min. merchanical drilling size	0.15mm

	Min.laser blind drilling size	0.10mm

	Ratio of thickness to via size	12:1

	Min. annular ring	3mil

	Min. annular ring for component hole	6mil

	Min.via space(same network)	0.20mm




	Min. via space(different network)	0.35mm	consider aboutCAF



	Min. space for component holes	0.70mm

	Inner vias to copper distance	7mil

	Min. half hole	0.4mm

	Via in pad or resin plugged via diameter	0.10-0.6mm



Tolerance	Via diameter tolerance	±3mil(PTH)

		±2mil(NPTH)

		±2mil(pressfit hole)

	Dimension tolerance	±0.10mm

	Slot size tolerance	±0.10mm

	Impedance control value tolerance	±8％

	Board thickness tolerance	±8％（board thickness＞1.0mm)


		±0.10mm(board thickness≤1.0mm)


	Deep drilling via tolerance	±0.10mm

	Trace width tolerance	±2mil（trace width＞10mil)

		±20%( trace width≤10mil)

Item		Specifications		Remark
Surface finish	Immersion gold	Max. gold thickness	8u"

	Hard gold	Max. gold thickness	2.0um

	Immersion tin	Tin thickness	0.8-1.2um

	Immersion silver	Silver thickness	0.15-0.25um

	OSP	Film thickness	0.2-0.5um


	Hasl with lead/Hasl lead free	Tin thickness	2-40um

		Board thickness	0.6mm≤H≤3.0mm




Others	Bow and twist	0.5%

	Soldermask bridge	IC space(green oil)	7mil

		IC space(oil with other color)	8mil


	Copper thickness	Inner layer	12OZ

		Outer layer	15OZ


	Drilling times for mechanical blind vias	≤3 times

	Board thickness	Max. thickness	6.8mm

		Min. thickness	0.2mm（double-sided）

For more special capability, please refer to your dedicated sales

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