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Panel For Example Panel For Example Panel For Example

Specifications

CategoryCapabilityMass batchSmall Batch Sample Order
Base Material Normal Tg Value FR-4 Shengyi S1141    
High Tg Value, Halogen Free Shengyi S1165 (Orange-red core board)    
High CTI Shengyi S1600(CTI≥600V)    
High Tg Value FR-4 S1000-2, S1000-2M, IT180A    
Ceramic Powder Filled High Frequency Board Rogers4003, Rogers4350, Arlon25N    
PTFE High Frequency Material: Rogers, Taconic, Arlon, WANGLING    
PTFE Prepreg Taconic, TPG, Fastrise    
High Speed (1-5 G) Tu-862, S7038, S1165, Isola-FR408HR, Isola-FR406, EMC-EM370, IT170GRA    
High Speed (5-10 G) Tu-872, s7439, N4000-13SI, M4, Tu-863    
High Speed (10-25 G) M6, Tu-883    
High Speed (>25 G) M7, Tu-993    
Layers 1-30 1-30 1-30 1-30
Laser order 1-4 1-3 1-3 1-4
Delivery Size (mm) Max Size (mm) 460*560 460*560 550*900
Min Size (mm) 10*10 10*10 10*10
Width / Gap Inner(mil) 0.5OZ base copper:3/3 1.0OZ base copper:4/4 2.0OZ base copper:5/6
3.0OZ base copper:7/9 4.0OZ base copper: 8/12 5.0OZ base copper: 10/15
6.0OZ base copper: 12/18 10 OZ base copper: 18/24 12 OZ base copper: 20/28
Outer(mil) 1/3OZ base copper:3/3 0.5OZ base copper:4/4 1.0OZ base copper:5/5
2.0OZ base copper:6/8 3.0OZ base copper: 7/10 4.0OZ base copper: 8/13
5.0OZ base copper: 10/16 6.0OZ base copper: 12/18 10 OZ base copper: 18/24
12 OZ base copper: 20/28 15 OZ base copper: 24/32  
Line Width Tolerance >10.0 mil ±20% ±1.5mil ±1.0mil
≤10.0 mil ±20% ±1.0mil ±1.0mil
Copper Thickness Inner layer(OZ) 6 6 6
Out layer(OZ) 8 8 8
Inner double layer 18/35um、35/70um 18/35um、35/70um 18/35um、35/70um、70/105um
Board thickness for resin plug hole 0.3-4.0mm 0.3-4.0mm 0.3-4.0mm 0.3-4.0mm
Board thickness(mm) 0.1-8 0.3-5.0 0.3-5.0 0.1-8.0
Board Thickness tolerance >1.0 mm ±10% ±8% ±8%
≤1.0 mm ±0.1mm ±0.1mm ±0.1mm
Board thickness/drill bit   10:01:00 12:01:00 13:01:00
Contour Bevel edge 20-60 degree, ±5degree 20-60 degree, ±5degree 20-60 degree, ±5degree
Bow and twist   ≤0.75% ≤0.75% ≤0.5%

Drilling & Hole

CategoryCapabilityMass batchSmall Batch Sample Order
Drilling Min laser (mm) 3mil 3mil 3mil
Max laser (mm) 8mil 8mil 8mil
Min CNC(mm) 0.2 0.15 0.15
Max CNC drill bit(mm) 6.5 6.5 6.5
Min Half Hole(mm) 0.5 0.4 0.4
PTH Hole Normall (mm) ±0.1 ±0.075 ±0.075
PTH Hole Pressing Hole(mm) ±0.05 ±0.05 ±0.05
Hole Angle (conical) Width of upper diameter≤6.5mm:800、900、1000、1100; Width of upper diameter≥6.5mm:900;
Precision of Depth-control Drilling(mm) ±0.10 ±0.075 ±0.05
Number of blind CNC holes of one side ≤2 ≤3 ≤4
Minimum via hole spacing (different network, military, medical, automobile )mm 0.5 0.45 0.4
Minimum via hole spacing (different network, general industrial control and consumer electronic ) mm 0.4 0.35 0.3
The minimum hole wall spacing of the over hole (the same network mm) 0.2 0.2 0.15
Minimum hole wall spacing (mm) for device holes 0.8 0.7 0.7
The minimum distance from via hole to the inner copper or line 0.2 0.18 ≤10L: 0.15
      >10L: 0.18
The min distance from Device hole to inner copper or line 0.3 0.27 0.25
Diameter range of resin plug hole (mm) 0.1-0.45 0.1-0.45 0.1-0.7
Min diameter of back drilling (mm) 0.5 0.5 0.2
Back drill depth accuracy tolerance (mm) ±0.05 ±0.03  
Max Ratio of hole diameter to board thickness 10:1 10:1 20:1
Tapered hole, stepped hole angle and diameter Special drills: 82°, 90°, 100°, 135° (diameter range of tapered hole drills is 0.3-10mm) Special drills: 82°, 90°, 100°, 135° (diameter range of tapered hole drills is 0.3-10mm) Special drills: 82°, 90°, 100°, 135° (diameter range of tapered hole drills is 0.3-10mm)
Normal drills: Angle 130° (drill φ≤3.175mm), 165° (drill φ 3.175--6.3mm) Normal drills: Angle 130° (drill φ≤3.175mm), 165° (drill φ 3.175--6.3mm) Normal drills: Angle 130° (drill φ≤3.175mm), 165° (drill φ 3.175--6.3mm)
Welding Ring(mil) Via hole 4(HDI 3mil) 3.5(HDI 3mil) 3
  Component hole 8 6 6
Final Board Thickness >1.0 mm ±10% ±8% ±8%
≤1.0 mm ±0.1mm ±0.1mm ±0.1mm
CNC contour tolerance(mm) ±0.15 ±0.10 ±0.10
V-CUT Tolerance of residual thickness(mm) ±0.15 ±0.10 ±0.10
(mm)      
Routing slot(mm) ±0.15 ±0.10 ±0.10
Precision of controlled deep milling(mm) ±0.15 ±0.10 ±0.10

Solder Mask

CategoryCapabilityMass batchSmall Batch Sample Order
Solder Dam (mil)(solder mask)544
(hybrid)655
Solder Mask Color Green, Yellow, Black, Blue, Red, White, Matte Green, Matte Black, Orange
Silkscreen Color White, Yellow, Black, Orange

Surface Treatment

CategoryCapabilityMass batchSmall Batch Sample Order
Immersion goldNi thickness (micro inch)118-236118-236118-236
Max gold (uinch)336
Hard gold(Au thick)Gold fingerAngle: 20°, 30°, 45°, 60°Angle: 20°, 30°, 45°, 60°Angle: 20°, 30°, 45°, 60°
NiPdAuNI (uinch)118-236
PA (uinch)2-5
Au (uinch)1-5
Graph electric goldNI (uinch)120-400
AU (uinch)1-3
Immersion tinTin (um)0.8-1.2
Immersion AgAg (uinch)6-10
OSPthick (um)0.2-0.5
HAL/HAL LFBGApad(mm)≥0.3×0.3
thickness (mm)0.6≤H≤3.0
Board thickness vs hole diameterPress hole≤3:1
Tin(um)2.0-40.0
Other Soft gold, Immersion gold+OSP, HAS+Gold finger, Immersion gold+gold finger, Water gold+Selective hard gold, OSP+Gold finger

Special Technique

CategoryCapabilityMass batchSmall Batch Sample Order
Special TechniqueBack drilling PCB, metal sandwich, thick copper buried blind hole, step slot, disc hole, half hole, mixed laminationBuried magnetic core PCBBuried capacitor / resistor, embedded copper in partial area, 100% ceramic PCB, buried riveting nut PCB, embedded components PCB