Siemens Digital Industries Software has deepened its collaboration with TSMC to advance semiconductor design and integration, enabling customers to tackle next-generation technology challenges. This partnership leverages Siemens' EDA tools and TSMC's advanced process nodes, including N3P, N3C, and A14, to drive innovation in AI, automotive, hyperscale computing, and mobile applications.
Certified Tools for Advanced Nodes
Siemens¡¯ Calibre nmPlatform, including nmDRC, nmLVS, PERC, and YieldEnhancer with SmartFill, has been certified for TSMC¡¯s N2P and A16 processes, ensuring robust signoff capabilities. Calibre xACT is certified for the latest N2P iteration. Siemens is also advancing tool certifications for TSMC¡¯s N3C technology, building on N3P solutions, and has initiated design enablement for the A14 process to support future designs.
3D Packaging and Thermal Analysis
As 3Dblox moves toward IEEE standardization, Siemens¡¯ Calibre 3DSTACK solution is certified for TSMC¡¯s 3DFabric and 3Dblox technologies, supporting silicon stacking and advanced packaging. Siemens¡¯ Innovator3D IC solution provides full abstraction-level support for 3Dblox, enhancing thermal analysis and 3D packaging workflows.
Analog and Mixed-Signal Design
Siemens¡¯ Analog FastSPICE (AFS) is certified for TSMC¡¯s N2P and A16 processes, supporting next-generation analog, mixed-signal, RF, and memory designs. AFS, part of TSMC¡¯s N2 custom design reference flow (CDRF), enables reliability-aware simulation for aging and self-heating effects. The N2P CDRF also integrates Siemens¡¯ Solido Design Environment for advanced variation-aware verification.
Photonic and Power Integrity Solutions
Siemens and TSMC are developing design solutions for TSMC¡¯s Compact Universal Photonic Engine (COUPE) using Calibre 3DSTACK and AFS, combining Siemens¡¯ expertise with TSMC¡¯s advanced processes. Siemens¡¯ mPower software is undergoing certification for N2P, offering physical implementation and electromigration/IR drop analysis for analog and digital designs.
Cloud-Based Workflows
Seven Siemens tools¡ªSolido SPICE, Analog FastSPICE, Calibre nmDRC, Calibre YieldEnhancer with SmartFill, Calibre nmLVS, Calibre PERC, Calibre xACT, and mPower¡ªhave been certified for production-ready signoff in the AWS cloud, ensuring secure, high-accuracy cloud-based workflows.
Strategic Impact
Siemens EDA CEO Mike Ellow emphasized that the TSMC alliance enhances Siemens¡¯ portfolio and empowers customers to address future challenges. TSMC¡¯s Y.L. Yuan, Senior Director of Advanced Technology Business Development, noted that combining Siemens¡¯ design solutions with TSMC¡¯s advanced processes drives customer innovation. This collaboration, part of TSMC¡¯s Open Innovation Platform (OIP), pushes semiconductor technology boundaries for AI, automotive, and mobile applications.
