
EDA Expands Beyond Chip Design
EDA evolves beyond chip design, integrating AI/ML and multi-physics simulation for trillion-dollar markets in system design and digital twins.
EDA evolves beyond chip design, integrating AI/ML and multi-physics simulation for trillion-dollar markets in system design and digital twins.
Siemens and TSMC enhance IC design collaboration with advanced processes and certifications for innovative chip manufacturing.
Siemens and TSMC collaborate to advance semiconductor innovation with EDA tools and cutting-edge process nodes for AI and automotive tech.
Synopsys and NVIDIA collaborate to boost chip design with up to 30x faster EDA performance on Grace Blackwell platform.
US lifts EDA export curbs to China for 28nm+ designs; Synopsys, Cadence, Siemens resume sales amid eased restrictions.