Hybrid Bonding to Debut with HBM4E
SK Hynix pioneers hybrid bonding in HBM4E, enhancing bandwidth, efficiency, and memory integration for AI and high-performance computing.
Electronics
SanDisk Raises NAND Prices Over 10% in 2025
SanDisk raises NAND flash prices over 10% in 2025 due to supply constraints and AI demand, signaling market recovery and innovation.
Electronics
Siemens and TSMC Boost Semiconductor Innovation
Siemens and TSMC collaborate to advance semiconductor innovation with EDA tools and cutting-edge process nodes for AI and automotive tech.
Electronics
HBM3E Boosts Bandwidth for AI Training Workloads
HBM3E boosts AI training with 9.6 Gb/s bandwidth, offering high performance and efficiency for accelerators and GPUs.
Electronics