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Category:PCB BGA
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.
Hi, I would like to get in contact with people that have knowledge about the BGA mounting process. Please drop me an e-mail.(view more)
James KentHi: Can you give me some tips for choose a BGA rework system? Where can I buy this machines? Thanks for your help!(view more)
Antonio SemeraroCall it a “vanity” publishing project if you will, but Charles Pfeil’s book, BGA Breakouts & Routing, published by his employer, Mentor Graphics, is more than worth the price of admission. Pfeil, ...(view more)
PieroWe’ve all heard that those who forget history are doomed to repeat it, and our school systems work hard to teach students how to avoid those painful, misery inducing historical mistakes. Similarly, if...(view more)
Adrian WellingsBall Grid Array rework is one of the most challenging procedures performed at assembly facilities and repair depots around the world. Doing it right depends in large part on the skills and knowledge o...(view more)
BernardSource: BGA NET COMPANY I was asked by many PCB designers about BGA design guidelines, say ball PAD size, pitch size, annular ring, layer counts, solder mask opening, etc. There is no ready answ...(view more)
BuckThe ball grid array (BGA) is a surface-mount chip package that is used to mount embedded devices (e.g. microprocessors) by melting balls of solder between the face of the device and the circuit board....(view more)
Caesar
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