Category:PCB BGA

Group Administrators: 1 | Group Member: 97 | Group Threads: 97

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.;

Search Results: 97 Threads,10 Pages Post A Thread
4 comments
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BGA questions

Hi, I would like to get in contact with people that have knowledge about the BGA mounting process. Please drop me an e-mail.(See More)

James Kent
2017/2/1 13:19:32
3 comments
365 views

BGA

Hi: Can you give me some tips for choose a BGA rework system? Where can I buy this machines? Thanks for your help!(See More)

Antonio Semeraro
2017/2/1 8:33:22
1 comments
1925 views

BGA Breakouts and Routing

Call it a “vanity” publishing project if you will, but Charles Pfeil’s book, BGA Breakouts & Routing, published by his employer, Mentor Graphics, is more than worth the price of admission. Pfeil, ...(See More)

Piero
2017/1/25 14:01:20
1 comments
2185 views

About Flip-Chip BGA Failure Mechanisms

We’ve all heard that those who forget history are doomed to repeat it, and our school systems work hard to teach students how to avoid those painful, misery inducing historical mistakes. Similarly, if...(See More)

Adrian Wellings
2017/1/21 17:57:35
1 comments
2035 views

Common Mistakes in BGA Rework

Ball Grid Array rework is one of the most challenging procedures performed at assembly facilities and repair depots around the world. Doing it right depends in large part on the skills and knowledge o...(See More)

Bernard
2017/1/21 6:20:58
1 comments
2667 views

BGA Design Tips

Source: BGA NET COMPANY I was asked by many PCB designers about BGA design guidelines, say ball PAD size, pitch size, annular ring, layer counts, solder mask opening, etc. There is no ready answ...(See More)

Buck
2017/1/18 8:27:29
1 comments
2385 views

Reagrding Test and BGAs on PCBs

The ball grid array (BGA) is a surface-mount chip package that is used to mount embedded devices (e.g. microprocessors) by melting balls of solder between the face of the device and the circuit board....(See More)

Caesar
2017/1/17 9:30:41