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BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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BGA
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Antonio Semeraro

Hi:
Can you give me some tips for choose a BGA rework system? Where can I buy this machines?
Thanks for your help!
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Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.

Hector Jose

Remarkable.

Eric Flores Solis

Your article answered all my puzzles.

Khairul Mustaqim

Interesting and useful!

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