● The composition of the epoxy laminates
● Some special properties of epoxy resin
In PCB manufacturing, the base material of epoxy laminates is reinforced with glass fiber or paper fiber as filler. Besides, epoxy resin and the copper foil are pressed over it to get copper clad laminates. Hence, they are called “glass epoxy copper clad laminates” or “paper epoxy copper clad laminates”. It all depends on the type of filler used. During the epoxy laminations process, the epoxy resin is cured by the action of heat, pressure and the added catalyst. The final product is a thermosetting resin which is neither feasible nor soluble.
Some special properties of epoxy resin are as follows:
During cure, it shows very low shrinkage.
They are tough materials.
It forms an outstanding adhesion bond.
Exhibit high mechanical strength.
It has extremely high alkali resistance or even excellent acid and solvent resistance.
It shows good electrical properties over a wide range of temperature and frequency.
They are first-class insulating materials vs high dielectric strength.
It can attest to its excellent moisture barriers and low water absorption.
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