Category:PCB Packaging Technology

Group Administrators: 1 | Group Member: 19 | Group Threads: 12

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622 views

DES Line Etching Uniformity Test Report

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leonard.roussel
2019/7/30 10:35:44
0 comments
620 views

How to Panelized Different PCB Boards on AD Software

The panel board is to combine multiple separate boards (boards that are not connected to each other) into one board for casting. In this case, a variety of boards can be produced at one time, and the ...(view more)

snsadmin
2019/1/14 19:10:14
5 comments
1098 views

QFN Packages

We are developing a new product, and some of the designers are proposing QFN packages. These look like leadless QFP's. We don't currently use anything like this, but we operate in a high reliability a...(view more)

rayy2007
2017/2/28 1:14:42
4 comments
886 views

Heat Sink for QFP

Hi. We are designing in a 128 pin LQFP that has a heat sink in the center of the package. The size of this is 7.44 by 7.55 mm. Can anyone recommend what pad size should be on the board for this?...(view more)

david.rambeau.tea
2017/2/27 23:54:03
1 comments
1639 views

Something about PCB/IC Package Design Tool

In one integrated environment, designers can now implement gigabit serial interfaces in high-speed printed-circuit-board (PCB) systems. Version 15.0 of Cadence's packaging design environment includes ...(view more)

dydzld765lebl9
2017/2/8 1:56:42
4 comments
997 views

MLP (Micro Leadframe Package)

Hi: I'm looking for input from anyone who has experience assembling the MLP package on PCBs. We are experiencing solder opens after assembly, and I'm curious to see how others are processing these cri...(view more)

Benedict
2017/2/2 1:54:46
1 comments
766 views

Design in Package Flexibility into PCB

To err is human. And to order the wrong component foot print is just part of engineering. It happens to us all; You’re working hard to finish a design, you have PCBs on the way and you’re putting in y...(view more)

etb2.binsbergen
2017/2/1 16:27:58
4 comments
968 views

DOUBLE REFLOW WITH HEAVY WEIGHT PLCC PACKAGE

Hi, We have encountered one serious problem that heavy packages falling down during second side reflow, especially for PLCC 84. I believe it caused by temperature profile setting. Any good suggestion ...(view more)

Paolo
2017/2/1 13:43:53
1 comments
2657 views

Package Offers Flip-Chip Support

To help automate the interconnect process between bare die and a pc board, PowerBGA 3.0 provides flip chip design tools, support for design reuse methodologies with a new physical design reuse (PDR) m...(view more)

Garry Thorn
2017/1/21 17:09:43
1 comments
2872 views

The Thermal Design in Exposed-Pad Packages

This technical brief discusses thermal design techniques for IC packages—such as QFN, DFN, and MLP—that incorporate an exposed thermal pad. Most designers are by now quite familiar with integrat...(view more)

Mustafa ozcelik
2017/1/19 20:39:51

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