Category:Electronic Components Packaging Technology

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Having problems with component package? THT or SMT? Join us and learn together.

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Search Results: 10 Threads,1 Pages
5 answers
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QFN Packages

We are developing a new product, and some of the designers are proposing QFN packages. These look like leadless QFP's. We don't currently use anything like this, but we operate in a high reliability a... (See More)

rayy2007
2017-02-28 01:14:42
Nikolay Dovgilov
2017-03-02 01:14:42
4 answers
425 views

Heat Sink for QFP

Hi. We are designing in a 128 pin LQFP that has a heat sink in the center of the package. The size of this is 7.44 by 7.55 mm. Can anyone recommend what pad size should be on the board for this?... (See More)

david.rambeau.tea
2017-02-27 23:54:03
Csaba Simon
2017-03-01 23:54:03
1 answers
1030 views

Something about PCB/IC Package Design Tool

In one integrated environment, designers can now implement gigabit serial interfaces in high-speed printed-circuit-board (PCB) systems. Version 15.0 of Cadence's packaging design environment includes ... (See More)

dydzld765lebl9
2017-02-08 01:56:42
hlmcorreo
2017-02-10 01:56:42
4 answers
436 views

MLP (Micro Leadframe Package)

Hi: I'm looking for input from anyone who has experience assembling the MLP package on PCBs. We are experiencing solder opens after assembly, and I'm curious to see how others are processing these cri... (See More)

Benedict
2017-02-02 01:54:46
John
2017-02-04 01:54:46
1 answers
355 views

Design in Package Flexibility into PCB

To err is human. And to order the wrong component foot print is just part of engineering. It happens to us all; You’re working hard to finish a design, you have PCBs on the way and you’re putting in y... (See More)

etb2.binsbergen
2017-02-01 16:27:58
makersoutpost
2017-02-03 16:27:58
4 answers
536 views

DOUBLE REFLOW WITH HEAVY WEIGHT PLCC PACKAGE

Hi, We have encountered one serious problem that heavy packages falling down during second side reflow, especially for PLCC 84. I believe it caused by temperature profile setting. Any good suggestion ... (See More)

Paolo
2017-02-01 13:43:53
Sergio Vasconcelos
2017-02-03 13:43:53
1 answers
2222 views

Package Offers Flip-Chip Support

To help automate the interconnect process between bare die and a pc board, PowerBGA 3.0 provides flip chip design tools, support for design reuse methodologies with a new physical design reuse (PDR) m... (See More)

Garry Thorn
2017-01-21 17:09:43
selcukbircan
2017-01-23 17:09:43
1 answers
2414 views

The Thermal Design in Exposed-Pad Packages

This technical brief discusses thermal design techniques for IC packages—such as QFN, DFN, and MLP—that incorporate an exposed thermal pad. Most designers are by now quite familiar with integrat... (See More)

Mustafa ozcelik
2017-01-19 20:39:51
info
2017-01-21 20:39:51
1 answers
2246 views

How About the Small Packages in .Net Micro Framework?

With the latest installment in beta testing, Microsoft’s .NET Micro Framework is into its third incarnation. The production version is 2.5. It targets more compact platforms like those from SJJ Micro’... (See More)

Michel Froehlich
2017-01-19 19:39:32
Bernie
2017-01-21 19:39:32
1 answers
390 views

How to measure the actual package temperature of PCB components?

Are there any method or tips for accurately and easily measuring temperature of individual components on PCBs? (See More)

IngeniApp
2017-01-02 14:42:40
tony165
2017-01-04 14:42:40
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Search Results: 10 Threads,1 Pages