Description

<style>.e_editor{font:14px/24px Roboto,Helvetica,Tahoma,Arial,'Microsoft YaHei','b8bf53';}.e_editor div,e_editor p,e_editor td,e_editor th,e_editor li{font-weight:inherit;font-size:inherit;font-style:inherit;font-family:inherit;}.e_editor ul{margin:-10px 0 20px;}.e_editor li{padding:5px 0;}.e_table{width:96%;border-collapse:collapse;empty-cells:show;}.e_table th,.e_table td{padding:5px;border:2px solid #eee;}.e_img{padding:10px 0;text-align:center;}.e_p{line-height:20px;padding:0 0 20px;text-indent:0em;}</style> <div class="e_editor"> <div class="e_img"> <img src="https://file.allpcb.com/bbs/17/06/15/093949343.jpg" width="600" height="319" /> </div> <div class="e_p"> 1. In high requirements, you should provide complete package for the inner conductor, and using coaxial connector to ensure the integrity of the electric field shielding. </div> <div class="e_p"> 2. vias: In high-speed signal, the via produces 1-4nH inductance and 0.3-0.8pF capacitor. As a result, the vias of the high-speed channels should be as small as possible. Make sure that the number of vias for the high-speed parallel lines is the same. </div> <div class="e_p"> 3. Stubs: Avoid using short lines at high frequency and sensitive signal lines </div> <div class="e_p"> 4. Star signal arrangement: Avoid high-speed and sensitive signal lines </div> <div class="e_p"> 5. Radiation type signal arrangement: to avoid the use of high-speed and sensitive lines, to keep the signal path width unchanged, the vias through the power surface and the ground should not be too intensive. </div> </div>