
AMG8816: High-Integration BMS Chip
AMG8816: A high-integration BMS chip for 3-16 cell lithium packs with advanced protection, precision data, and low-power design.
AMG8816: A high-integration BMS chip for 3-16 cell lithium packs with advanced protection, precision data, and low-power design.
Apple advances smart glasses chip and AI server tech, targeting launches by 2026-2027 to compete in wearable and AI markets.
EDA evolves beyond chip design, integrating AI/ML and multi-physics simulation for trillion-dollar markets in system design and digital twins.
GalaxyCore launches GC3A71, its first OLED driver for smartwatches, featuring low power, high resolution, and vibrant displays.
Explore half-duplex vs. full-duplex in chip design, their differences, applications, and impact on communication systems.
Explore how structural hierarchy manages chip design complexity with a divide-and-conquer approach, addressing capacity and teamwork.
Explore key factors like process technology, architecture, and manufacturing that impact chip performance and efficiency.
Samtec and Broadcom demo 200G copper tech with Si-Fly HD at DesignCon 2025, showcasing 224G PAM4 interconnects for AI and data centers.
Synopsys and NVIDIA collaborate to boost chip design with up to 30x faster EDA performance on Grace Blackwell platform.
US lifts EDA export curbs to China for 28nm+ designs; Synopsys, Cadence, Siemens resume sales amid eased restrictions.
Explore what makes AI chip design unique, from custom architectures to verification challenges and future innovations like homomorphic encryption.