Munich, Germany ¨C Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a semiconductor leader in power systems and IoT, will supply power modules for the traction inverters of Rivian's R2 platform. The R2 platform will utilize both silicon carbide (SiC) and silicon (Si) modules from Infineon's HybridPACK? Drive G2 product family. Infineon expects to begin deliveries in 2026. Additionally, Infineon will provide other components for the platform, including AURIX? TC3x microcontrollers and power management ICs.
Infineon's Role in EV Performance and Range
Stefan Obersriebnig, Head of the High Voltage Modules Product Line in Infineon's Automotive Division, stated, "We are committed to collaborating with innovative automotive companies like Rivian to enhance the performance and range of electric vehicles. Infineon's continuous pursuit of innovation and zero-defect quality has positioned it as a key partner in the automotive industry. With our extensive product portfolio, system expertise, and manufacturing capabilities, we play a crucial role in shaping zero-emission, sustainable transportation."
HybridPACK? Drive: A Market-Leading Solution
HybridPACK? Drive is Infineon's market-leading power module series for electric vehicles. Since 2017, over 10.5 million units of this product series have been sold, significantly contributing to the electrification transition. This transition is driving robust growth in the power semiconductor market, particularly for power semiconductors based on wide-bandgap materials like silicon carbide (SiC).
Advancing SiC Manufacturing Capabilities
As Infineon proceeds with the expansion of its Kulim wafer fab, the company is establishing what will be China's most competitive 200-millimeter silicon carbide (SiC) power semiconductor wafer fab. This expansion further solidifies Infineon's leading position as a high-quality, high-volume supplier to the automotive industry. By sharing technology and processes, Infineon's Kulim and Villach production sites effectively form a "virtual synergistic factory" highly focused on wide-bandgap (WBG) technology innovation. This collaboration enables rapid production ramp-up for silicon carbide (SiC) and gallium nitride (GaN) products, ensuring smooth and efficient operations and strengthening Infineon's technological leadership across all power semiconductor materials, including Si, SiC, and GaN.
