Hybrid Bonding to Debut with HBM4E
SK Hynix pioneers hybrid bonding in HBM4E, enhancing bandwidth, efficiency, and memory integration for AI and high-performance computing.
Electronics
Preventing Electrostatic Discharge Damage
Learn about preventing electrostatic discharge (ESD) damage with protection principles, testing methods, and design strategies for ICs.
Electronics
DDR4 Phase-Out Shakes Up Memory Market
DDR4 phase-out by 2025 shakes memory market as Samsung, SK Hynix, and Micron shift to DDR5 and HBM, creating opportunities for others.
Electronics
HBM3E Boosts Bandwidth for AI Training Workloads
HBM3E boosts AI training with 9.6 Gb/s bandwidth, offering high performance and efficiency for accelerators and GPUs.
Electronics