Hybrid Bonding to Debut with HBM4E
SK Hynix pioneers hybrid bonding in HBM4E, enhancing bandwidth, efficiency, and memory integration for AI and high-performance computing.
Electronics
SanDisk Raises NAND Prices Over 10% in 2025
SanDisk raises NAND flash prices over 10% in 2025 due to supply constraints and AI demand, signaling market recovery and innovation.
Electronics
Understanding Why DRAM Requires Refreshing
Learn why DRAM requires refreshing, its structure, and how it differs from SRAM in this detailed guide to memory technology.
Electronics
AI Storage Trends: QLC and SSDs Surge in 2025
Explore AI storage trends for 2025, focusing on QLC NAND, enterprise SSDs, and growth in AI servers, smartphones, PCs, and automotive.
Electronics
DDR4 Phase-Out Shakes Up Memory Market
DDR4 phase-out by 2025 shakes memory market as Samsung, SK Hynix, and Micron shift to DDR5 and HBM, creating opportunities for others.
Electronics
HBM3E Boosts Bandwidth for AI Training Workloads
HBM3E boosts AI training with 9.6 Gb/s bandwidth, offering high performance and efficiency for accelerators and GPUs.
Electronics
Leveraging New DRAM Advancements to Enhance Embedded System Performance
Explore how DDR3 DRAM advancements boost embedded system performance with higher speeds and power efficiency.
Electronics