EDA Expands Beyond Chip Design

EDA evolves beyond chip design, integrating AI/ML and multi-physics simulation for trillion-dollar markets in system design and digital twins.

Features and Uses of Four IC Packaging Types

Explore the features and uses of four IC packaging types: DIP, SOP, COB, and BGA, crucial for chip protection and performance.

Half-Duplex vs. Full-Duplex in Chip Design

Explore half-duplex vs. full-duplex in chip design, their differences, applications, and impact on communication systems.

Hierarchy in Managing Chip Design Complexity

Explore how structural hierarchy manages chip design complexity with a divide-and-conquer approach, addressing capacity and teamwork.

IC Design Flow and Tools Overview

Overview of IC design flow, covering front-end and back-end processes, tools, and key steps like HDL coding and physical verification.

Key Factors Impacting Chip Performance

Explore key factors like process technology, architecture, and manufacturing that impact chip performance and efficiency.

QSPICE Enhances Power Design Efficiency

QSPICE boosts power design efficiency with advanced digital and analog simulation for cutting-edge projects in AI and electric vehicles.

What Makes AI Chip Design Unique?

Explore what makes AI chip design unique, from custom architectures to verification challenges and future innovations like homomorphic encryption.