Features and Uses of Four IC Packaging Types

Explore the features and uses of four IC packaging types: DIP, SOP, COB, and BGA, crucial for chip protection and performance.

Key Factors Impacting Chip Performance

Explore key factors like process technology, architecture, and manufacturing that impact chip performance and efficiency.

Key Factors in Energy Storage PCB Design

Explore key factors in energy storage PCB design for renewable energy and EVs, focusing on thermal management and safety.

Rockwell Launches PharmaSuite 12.00 for Life Sciences

Rockwell launches PharmaSuite 12.00, a compliant MES for life sciences with cloud-ready features and enhanced cybersecurity.

Siemens and TSMC Boost IC Design Collaboration

Siemens and TSMC enhance IC design collaboration with advanced processes and certifications for innovative chip manufacturing.

ITES Shenzhen 2025 Showcases Industrial Innovation

ITES Shenzhen 2025 highlights industrial innovation with advanced manufacturing, robotics, and smart solutions from over 1,500 exhibitors.