Hybrid Bonding to Debut with HBM4E

SK Hynix pioneers hybrid bonding in HBM4E, enhancing bandwidth, efficiency, and memory integration for AI and high-performance computing.

Understanding Why DRAM Requires Refreshing

Learn why DRAM requires refreshing, its structure, and how it differs from SRAM in this detailed guide to memory technology.

3D NAND Hits 400+ Layers with Hybrid Bonding

3D NAND exceeds 400 layers with hybrid bonding. Samsung adopts Yangtze Memory¡¯s Xtacking for V10 NAND, boosting density and performance.