The second day of the 2025 Munich Shanghai Electronics Show highlighted advancements in industrial control, connectivity, third-generation semiconductors, precision testing, and passive components. These technologies drive intelligent manufacturing and sustainable energy systems, aligning with global trends in digitalization and green development.
Edge Intelligence and Robust Connectivity
Modern manufacturing is shifting from automation to autonomous systems, driven by industrial IoT, AI, and edge computing. These enable real-time optimization, predictive maintenance, and precise quality control. The integration of IT and OT technologies supports data-driven decisions, requiring control systems with edge intelligence, functional safety, and robust cybersecurity for flexible production and human-machine collaboration.
Industrial Control Solutions
Programmable logic controllers (PLCs) are critical for industrial control, relying on high-performance analog components. Key products showcased include:
- Shengbang Micro (SGM58601): A 24-bit, 8-channel Delta-Sigma ADC with 60kSPS output, 64x PGA, and SPI interface, operating from -40¡ãC to +125¡ãC. It supports PLC/DCS applications with high-resolution measurements.
- Guomin Technology (N32H47/8 MCU): Cortex-M4-based MCU with 240MHz clock, floating-point co-processors, and 125ps timers. It excels in digital power, industrial control, and motor control with enhanced safety and reliability.
- Qinheng (CH32V317 MCU): RISC-V MCU with 480Mbps USB PHY and 100Mbps Ethernet PHY, designed for industrial gateways, security, and photovoltaic inverters, supporting high-bandwidth communication.
Advanced Connectivity
Industrial connectivity demands high-speed data transfer, mixed power-signal transmission, and durability in harsh environments. Notable solutions include:
- Phoenix Contact (XPC Connector): Push-X spring connectors for tool-free wiring, with audible and visual feedback. Their slim I/O housing for PLCs, designed in China, offers customization and cost-effectiveness.
- Molex (CP-6.5 Connector): A foolproof wire-to-board system with color-coded shells to prevent mismating, ensuring reliable connections.
- Samtec (NovaRay/Flyover): High-speed cable solutions for 112Gbps PAM4, minimizing PCB signal loss to enhance integrity and reduce design complexity.
- Gaosong (SNAP-LOCK Connector): 3.81mm and 5.08mm pitch connectors for wire-to-board and through-board applications, offering vibration resistance and automation compatibility.
Third-Generation Semiconductors and Passive Components
The energy transition, driven by renewables and electric vehicles, relies on efficient power electronics. Silicon carbide (SiC) and gallium nitride (GaN) semiconductors, paired with advanced passive components, enable high-efficiency energy systems.
Power Semiconductors
Third-generation semiconductors offer lower losses and higher temperature tolerance. Highlighted products include:
- Shilan Micro (SGM100PA12A6ETFD_2): A three-phase IGBT module with integrated rectifier and brake, optimized for motor drives and auxiliary inverters.
- Shilan Micro (SGM225TL12D4DTFD): A three-level IGBT module for energy storage, with high current density and low conduction losses.
- Feizhen Semiconductor (Gen3 SiC MOSFETs): 750V and 1200V MOSFETs for photovoltaics and EV charging, with 1200V diodes for high surge currents.
- CR Microelectronics: 1200V 450A/600A SiC-based main drive modules with low losses, high power density, and 175¡ãC junction temperature for automotive applications.
- Ruineng Semiconductor: 650V¨C2200V SiC MOSFETs, diodes, and modules for AI computing, energy storage, and EV charging, including automotive-grade 750V¨C1700V products.
High-Performance Passive Components
Passive components must handle high voltages, ripple currents, and fast switching. Key products include:
- Taiyo Yuden (MCOIL): Metal-core inductors with low resistance and high current. The LSCN series reduces resistance by 53% and size by 56%, while LSEU cuts core loss by 30%.
- Yageo: Offers C4AK DC-link capacitors, FU-series supercapacitors, chip resistors, and MLCCs for diverse power applications.
- Nichicon (FPCAP): Solid polymer aluminum electrolytic capacitors with low ESR, high ripple current, and long lifespan, ideal for filtering and energy storage.
Precision Testing and Measurement
Complex industrial and energy systems require advanced testing for performance and reliability. Innovations include:
- Tektronix (TICP IsoVu Probe): A 1GHz isolated current probe with RF isolation, 140dB CMRR, and sub-4.7nV/¡ÌHz noise, ideal for SiC/GaN measurements.
- Keysight (HD3 Oscilloscope): Features 14-bit resolution, 50¦ÌV noise, 100Mpt memory, and stepless low-pass filtering from 3kHz to 500MHz for precise signal analysis.
- RIGOL (DS80000 Series): A 13GHz oscilloscope with 40GSa/s sampling, 4Gpt memory, and protocol analysis for high-speed design validation.
Conclusion
Day two of the 2025 Munich Shanghai Electronics Show showcased how industrial control, connectivity, SiC/GaN semiconductors, passive components, and testing technologies are shaping intelligent, sustainable manufacturing and energy systems. These innovations empower flexible production, renewable energy integration, and reliable high-power applications, driving the future of industry and energy.
