Hybrid Bonding to Debut with HBM4E

SK Hynix pioneers hybrid bonding in HBM4E, enhancing bandwidth, efficiency, and memory integration for AI and high-performance computing.

DDR4 Phase-Out Shakes Up Memory Market

DDR4 phase-out by 2025 shakes memory market as Samsung, SK Hynix, and Micron shift to DDR5 and HBM, creating opportunities for others.