Hybrid Bonding to Debut with HBM4E
SK Hynix pioneers hybrid bonding in HBM4E, enhancing bandwidth, efficiency, and memory integration for AI and high-performance computing.
Electronics
SK Hynix pioneers hybrid bonding in HBM4E, enhancing bandwidth, efficiency, and memory integration for AI and high-performance computing.
3D NAND exceeds 400 layers with hybrid bonding. Samsung adopts Yangtze Memory¡¯s Xtacking for V10 NAND, boosting density and performance.