Thank you very much for your valuable suggestion! We will solve it as soon as possible!


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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Community > Groups > BGA > X-Ray Recommendations
X-Ray Recommendations
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We place BGA, but until now have not used X-Ray inspection, and it would be a good thing to have. Can anyone recommend a low cost X-Ray that would get us by. We don't need something fast, but it should be able to show us clearly voids etc.
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Livio Collovini

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