X-RAY inspection equipment for BGA devic

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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X-RAY inspection equipment for BGA devices Reply 2017-02-28 13:48:38

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Martin Banky

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I am eager to hear from anyone who has experience with X-RAY inspection equipment (specifically for BGA devices) or can make any recommendations. Any knowledge of second hand equipment for sale would also be valuable. Regards

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Reply 2017-02-28 13:48:38

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