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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Community > Groups > BGA > X-Ray Criteria for BGA Solder Ball
X-Ray Criteria for BGA Solder Ball
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What's the maximum and minimum solder void that can be accepted during X-ray?
What about the percentage of Ball Roundness?
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