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After 2nd time reflow of double reflow, wrinkles solder joints found on SOIC and SOT components.(only happen on the components at the underside of pcb during reflow, top side components dont have this problem) is this due to the reflow process problems? any way to avoid this problem? will it cause any solder joint reliability problem? Thanks
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Bowen
3/3/2017 1:17:56 AM
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Richard Baggaley
3/3/2017 1:17:56 AM
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Adair
3/3/2017 1:17:56 AM
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