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Suggestions
We have a client we would like to have switch from leaded can components to surface mount versions. We currently are utilizing these on a number of designs but his concern is in the area of reliability of the solder interface. The caps generally have very low mass. One example of a part is
Nichicon UUA1H101MNR1GS This part has a case size of 10 x10, 5000 hours, higher imped/lower ripple Leaded part was 10x12.5 case size , 3000 hours
Can someone point me to where I can get some information on reliability? or just your opinion would be appreciated
Alvis
2017/3/3 1:56:09
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