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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Community > Groups > BGA > When is BGA Reballing not recommended?
When is BGA Reballing not recommended?
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Hi, We are experimenting with BGA recovery and we would like to know When is BGA Reballing not recommended?
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