What is the maximum temperatures electronic components can withstand in low pressure molding?
I'd like to overmold a PCBA, which has SMT components, with a low pressure molding process. The temperature of the hotmel material should be between 200°C and 215°C.
Does anyone know if this material temperature could be a problem for the electronic components? Do I have the risk that the solder melts? Is this stress too harmful for the components?