Going directly between pads with a track will lead people to think there is a manufacturing fault, especially if the soldermask on the track flakes off. Still it may be the best option on a very cramped board.
Usually a U shaped track coming out from the chip as CL suggests is the way to go.
Sebastian Charlak
2016/12/31 13:40:34
A large pour would allow more current, and would result in a larger solder blob. You probably need neither.
olah.mihaly
2016/12/31 13:49:05
Going directly between pads with a track will lead people to think there is a manufacturing fault, especially if the soldermask on the track flakes off. Still it may be the best option on a very cramped board.
Usually a U shaped track coming out from the chip as CL suggests is the way to go.
Sebastian Charlak
2016/12/31 13:40:34
A large pour would allow more current, and would result in a larger solder blob. You probably need neither.