I read an article that says "Flux selection usually depends on the following factors":
a) Solderability of pcb base metal or coating b) Corrosivity of vapours and residues c) electrical resistivity of residues d) Ease of removal of residues e) Soldering Temperature
Now, can someone explain to me regarding the above factors on "Why flux selection depends on the above 5 factors. Is that all I need to have a look when selecting flux for our Process ?
Paul K. McKneely
Like this post very much.
Remarkable.I have learned a lot from your post.
Thanks for your intelligence. Pretty interesting and useful.