I read an article that says "Flux selection usually depends on the following factors":
a) Solderability of pcb base metal or coating b) Corrosivity of vapours and residues c) electrical resistivity of residues d) Ease of removal of residues e) Soldering Temperature
Now, can someone explain to me regarding the above factors on "Why flux selection depends on the above 5 factors. Is that all I need to have a look when selecting flux for our Process ?
Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.