Thank you very much for your valuable suggestion! We will solve it as soon as possible!

BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Community > Groups > BGA > Via in Pad for BGAs
Via in Pad for BGAs
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hisham.i

Does anyone have any experience with via in pad for BGAs using conventional thru hole technology?
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Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.

John

This post is perfect for what I need. Thanks!

Cedric

It was truly informative. Your post is very useful.Many thanks for sharing!

Agustin

Please keep us up to date like this.

francois.jacob.hello

Your sharing is quite useful to my new project. Thanks a lot.

Benedict

I think you are a genuis. The idea in your post is quite helpful and lights me. I have been puzzled for a long time in my new project.

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