uBGA stencil design

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The purpose of an SMT stencil is to transfer solder paste to a bare circuit board. Before the assembly of the SMT components solder paste is printed onto the component pads of the printed circuit board by stencil, which are today usually manufactured from steel, more rarely from nickel or polyimide.

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uBGA stencil design

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dioannis

I was looking for an stencil design for a 0.5mm pitch uBGA. Pad size is 0.38mm in diameter. We have been using 5mil stencil with type 3 no clean paste. What size aperture should we be using? Any suggestions?

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2017/2/2 21:55:32

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certainly.90

Appreciate your sharing.Please keep up your updates.

2017/2/4 21:55:32

p_harris1234

Appreciate your sharing.Please keep up your updates.

2017/2/4 21:55:32

Miguel Angel

Appreciate your sharing.Please keep up your updates.

2017/2/4 21:55:32

Eduardo Gonzalez

Bravo! Hope you can write soon.

2017/2/4 21:55:32

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