This is a re-post of my previous message. I typed my Email address wrong in the other message. I am sorry for any inconvenience caused. Is there anyone who can tell me what is the maximum allowable soldering temperature when soldering a TQFP (Thin Quad Flat Pack) device in a reflow oven? We recently used a CY7C375i in a TQFP160 package and we experienced warping (bending) of this component in the reflow oven, due to excessive heat. We used Sn62Pb36Ag2 solder paste and our peak temperature was 215 degrees Celsius. Is there anyone who experienced this problem before? Should we use a solder with a lower melting point, or is there a problem with the components that we used? I would appreciate any help.
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