When using flexible printed boards, there are width differences in the wires; this is more likely to result in uneven thickness of the coating. To prevent this from happening, it is possible to attach a diversion cathode pattern to absorb uneven current distributed over the plating pattern, maximizing the uniform thickness of the coating on all locations.
![](https://file.allpcb.com/bbs/17/05/08/103912716.jpg)