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The way I used for getting an evenly tinned surface is to use room temp tin plating solution to, it seems expensive at first, but the solution lasts a long time and can be stored and reused if you make too much up.
For tinning, my method is to coat the traces with a flux pen as soon as the board is finished etching, then run all over them with the thinnest coat of solder from my iron.
I use the photo-etch technique and find that the small residue of resist remaining on the board after resist removal protects the copper.
Regarding the cutting of PCBs, tin snips do a good job for me.
Very helpful and valuable.
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