1. Spec references for max allowable untinned gold near glass seal and case body?
2. Low cost mechanical dip system to facilitate tinning of DIP parts.
(Low volume; currently using hand solder iron techniques to allow for max coverage without bridging to case; attempts at hand dipping into small solder pots resulted in a combination of solder bridging to case and irregular tinning of leads.)
2017/2/28 5:18:41
Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.
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