Thermal Relief BGA pad design traces

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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Thermal Relief BGA pad design traces

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Holger S.

Is there some good resources (.pdfs, websites, articles) that someone can point me to regarding design for bga footprints? I need to brush up on thermal relief design for bga footprints. I got a customer whose bga lands are masking defined on top of a large copper surface. There is no thermal relief for the pad from the large ground area since there is no trace connected to the pad. No what I mean? So... I need to find some guidelines on how to design bga lands that incorprate thermal relief for achieving uniform reflow etc.

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2017/2/2 18:52:22

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