Thank you very much for your valuable suggestion! We will solve it as soon as possible!


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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Community > Groups > BGA > Thermal Relief BGA pad design traces
Thermal Relief BGA pad design traces
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Holger S.

Is there some good resources (.pdfs, websites, articles) that someone can point me to regarding design for bga footprints? I need to brush up on thermal relief design for bga footprints. I got a customer whose bga lands are masking defined on top of a large copper surface. There is no thermal relief for the pad from the large ground area since there is no trace connected to the pad. No what I mean? So... I need to find some guidelines on how to design bga lands that incorprate thermal relief for achieving uniform reflow etc.
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Enrico Gensale



Quite useful and impressive info.

Sinan Atilla

I am happy that you shared this helpful information with us.


Remarkable.I have learned a lot from your post.

Roberto Burchi

What you share on your post is quite useful.

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