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You can use a via to connect from the signal planes
to the internal power or ground plane.
A via can help to connect to a ground plane. In case
of surface-mount component, there is separate via connected
to the surface-mount pad. In case of throughole component,
the pin is soldered into the via.
As someone answered for thru-hole components, I want to answer
for SMD components. Connect the ground or power leads to short
traces. A via placed on those traces should automatically
connect to the appropriate plane.
For thru-hole components, pins connected to the Vcc or GND nets will be automatically connected to the power or ground planes as needed.
If you put a big copper plane for ground on layer 2 and another one for power on 3 and assign them to the ground
and power nets. PADS will automatically connect them when you
flood the copper.
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