Does anyone know the cause(s) of solder flowing through a via to the other side of board during reflow causing solder bumps on opposite side? Is this mainly a design issue or could it be process related? Any help is appreciated.
3/1/2017 3:01:52 AM
Francisco?Javier?García?Oncala
Threads
9
Following
0
Followers
0
enrico.beccati
3/3/2017 3:01:52 AM
Marvelous posting.