Does anyone know the cause(s) of solder flowing through a via to the other side of board during reflow causing solder bumps on opposite side? Is this mainly a design issue or could it be process related? Any help is appreciated.
2017/3/1 3:01:52
Francisco?Javier?García?Oncala
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enrico.beccati
2017/3/3 3:01:52
Marvelous posting.