the cause of solder bumps

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In assembly the bare board is populated with electronic components, called a "printed circuit board assembly" (PCBA). In through-hole technology, the component leads are inserted in holes surrounded by conductive pads; In surface-mount technology (SMT), the component is placed on the PCB so that the pins line up with the conductive pads or lands on the surfaces of the PCB.

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the cause of solder bumps Reply 2017-03-01 03:01:52

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Francisco

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Does anyone know the cause(s) of solder flowing through a via to the other side of board during reflow causing solder bumps on opposite side? Is this mainly a design issue or could it be process related? Any help is appreciated.

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Reply 2017-03-01 03:01:52

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