IPC — Association Connecting Electronics Industries® will introduce a cyber conference at IPC APEX EXPO in Las Vegas in 2011. The IPC APEX EXPO Cyber Conference will feature live broadcasts and post-show archives of seven of the show’s thirty-five technical conference sessions on April 12–14, 2011.
Offering a new approach to learning, the IPC APEX EXPO Cyber Conference will enable individuals who are not able to travel to the show to experience a portion of the world’s premier technical conference for the electronics manufacturing industry from the convenience of their offices, homes or even on the road. In addition, since the IPC APEX EXPO technical conference includes up to five sessions running concurrently, having selected sessions available in the archive will allow on-site attendees to schedule their time more efficiently and attend more meetings and programs.
"As much as we'd love to see everyone in our industry in Las Vegas, we understand that for various reasons, sometimes that’s not possible,” says Kim Sterling, IPC vice president of membership, marketing & communications. “Cyber conference registrants will be able to get some of the benefits of the industry’s premier technical conference by viewing the online live stream of seven select sessions as they take place. They’ll be able to view the speaker, watch and download the presentation slides and interact and ask questions via live text chat."
The seven cyber conference sessions will feature new, never-before-published research:
S02: Encapsulation — Tuesday, April 12, 2011 1:30 pm–3:00 pm PT
A New Method for Measuring Conformal Coating Adhesion, Christopher Hunt, Ph.D., National Physical Laboratory
Introducing Novel Flame Retardant Materials to Produce Exceptionally Low Viscosity, High Temperature Resistant Epoxy Encapsulation Compounds, XiaoPing Lei, H. K. Wentworth Ltd.
Exploring the Performance of Silicone Gels at Low and High Temperatures, Carlos Montemayor, Dow Corning Corporation
S08: Soldering Processes II — Tuesday, April 12, 2011 3:15 pm–4:45 pm PT
Laser Based Technology for Solder Ball: Repair, Rework, and Reballing, Andrew Strandjord, Ph.D., Pac Tech USA Packaging Technologies Inc.
A Cost Effective and User Friendly N2 Inerting Technology for Lead-Free Wave Soldering, Chun Christine Dong, Ph.D., Air Products & Chemicals
Case Study Comparing the Solderability of a Specific Pb-Free, No-Clean Paste in Vapor Phase and Convection Reflow, Theron Lewis, IBM Corporation
S13: Lead Free: Surface Effects — Wednesday, April 13, 2011 9:00 am–10:00 am PT
Effects of Tin Whisker Formation on Nanocrystalline Copper, David Lee, Ph.D., Johns Hopkins University
Effect of Gold Content on the Reliability of SnAgCu Solder Joints, Jianbiao Pan, Cal Poly State University
S16: PCB Reliability Test Methods — Wednesday, April 13, 2011 10:15 am–11:45 am PT
A New Approach for Early Detection of PCB Pad Cratering Failures, Anurag Bansal, Cisco Systems Inc.
Analysis of Electrochemical Migration Kinetics Using Electrochemical Impedance Spectroscopy, Xiaofei He, University of Maryland
The Effects of Reflow on Conductive Anodic Filament (CAF) Performance of Materials, Kim Morton, Viasystems Technology Corp. LLC
S24: Cleaning — Wednesday, April 13, 2011 1:30 pm–3:30 pm PT
New Cleaning Agent Designs for Removing No-Clean Lead-Free Flux Residues, Mike Bixenman, DBA, Kyzen Corporation
Meeting the Challenge of Removing Flux Residues from Electronic Circuitry Utilizing Low Standoff Heights, Michael Savidakis, Petroferm
Comparative Cleaning Study to Showcase the Effective Removal of OA Flux Residues, Umut Tosun, ZESTRON America
Defluxing for New Assembly Requirements, Barbara Kanegsberg, BFK Solutions
S28: Thermal Cycling Lead-Free Reliability — Thursday, April 14, 2011 9:00 am–10:00 am PT
Pb-Free Solder Joint Reliability in a Mildly Accelerated Test Condition, Richard Coyle, Alcatel-Lucent
The Effects of Non-Filled Microvia in Pad on Pb-Free Solder Joint Reliability of BGA and QFN Packages in Accelerated Thermal Cycling, Joseph Smetana, Alcatel-Lucent
S33: Embedded — Thursday, April 14, 2011 10:15 am–11:45 am PT
Development of a Design & Manufacturing Environment for Reliable and Cost-Effective PCB Embedding Technology, Arnaud Grivon, Thales Services EPM
Failure Mechanisms in Embedded Planar Capacitors during High Temperature Operating Life (HTOL) Testing, Mohammed Alam, University of Maryland
Components: A Comparative Analysis of Reliability, Christopher Ryder, AT&S Austria Technologie & Systemtechnik AG
Registrants of the cyber conference as well as registrants of the full IPC APEX EXPO technical conference will have free access to archives of the seven sessions until August 31. In addition, they will each receive the full technical conference proceedings.