subject board fabrication calls for .05 -.125um of gold over 2 - 5 um of nickel. When doing double sided reflow using same profile, parts of the gold are tarnishing and causing test pad failures. any ideas as to the cause?
2017/2/2 16:07:11
Sinan Gunay
Threads
7
Following
0
Followers
0
PCB Assembly
SMT-Stencil
Components Sourcing
Pedro Skou
2017/2/4 16:07:11
Really appreciate your content.I hope you write again soon.
Henri Aroyan
2017/2/4 16:07:11
Pretty good and useful info to my job. Keep on checking your post.
jarmoblo
2017/2/4 16:07:11
Remarkable.It help me a lot. Thank you.
Andras Hollenczer
2017/2/4 16:07:11
Useful!