subject board fabrication calls for .05 -.125um of gold over 2 - 5 um of nickel. When doing double sided reflow using same profile, parts of the gold are tarnishing and causing test pad failures. any ideas as to the cause?
2/2/2017 4:07:11 PM
Sinan Gunay
Threads
7
Following
0
Followers
0
Pedro Skou
2/4/2017 4:07:11 PM
Really appreciate your content.I hope you write again soon.
Henri Aroyan
2/4/2017 4:07:11 PM
Pretty good and useful info to my job. Keep on checking your post.
jarmoblo
2/4/2017 4:07:11 PM
Remarkable.It help me a lot. Thank you.
Andras Hollenczer
2/4/2017 4:07:11 PM
Useful!