tarnishing gold surfaces

2017/2/2 16:07:11

subject board fabrication calls for .05 -.125um of gold over 2 - 5 um of nickel. When doing double sided reflow using same profile, parts of the gold are tarnishing and causing test pad failures. any ideas as to the cause?

• 466
• 4
• 30

Post Comment

Pedro Skou

2017/2/4 16:07:11

Really appreciate your content.I hope you write again soon.

Henri Aroyan

2017/2/4 16:07:11

Pretty good and useful info to my job. Keep on checking your post.

jarmoblo

2017/2/4 16:07:11

Remarkable.It help me a lot. Thank you.

Andras Hollenczer

2017/2/4 16:07:11

Useful!

You might like

• 

  My Full Review and Experience with ALLPCB

  • 11
  • 13
• 

  Price or quality?

  • 44
  • 10
• 

  Free PCB Board by ALLPCB Sponsorship

  • 63
  • 5
• 

  Lead-free Solder Paste for 0402 Metric Chip Components

  • 13
  • 4