tarnishing gold surfaces

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PCB manufacturing consists of many steps, such as PCB CAM, Panelization, Copper patterning, etc. This group is mainly talked about the problems during PCB manufacturing!

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Sinan Gunay

subject board fabrication calls for .05 -.125um of gold over 2 - 5 um of nickel. When doing double sided reflow using same profile, parts of the gold are tarnishing and causing test pad failures. any ideas as to the cause?

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2017/2/2 16:07:11

Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.

Pedro Skou

Really appreciate your content.I hope you write again soon.

2017/2/4 16:07:11

Henri Aroyan

Pretty good and useful info to my job. Keep on checking your post.

2017/2/4 16:07:11

jarmoblo

Remarkable.It help me a lot. Thank you.

2017/2/4 16:07:11

Andras Hollenczer

Useful!

2017/2/4 16:07:11

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