What should be solder paste stencil aperture proper size in comparison with PCB copper pad for lead free technology? When designing PCB foortprints I was using solder paste pad undersize of 2.5 mils (0.06mm) per side (solder paste pad size was 2.5 mils per side smaller that copper pads size) for all pads. Is it value acceptable? Can the same value of solder pads undersize be applied to all pads on the PCB?
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Yves van Moerbeke
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