Thank you very much for your valuable suggestion! We will solve it as soon as possible!


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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Community > Groups > BGA > SPC/Calibration for BGA rework machine
SPC/Calibration for BGA rework machine
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What do other people use to ensure that the BGA machine is within spec ie beform a weekly check and record on SPC charts?
We want to start recording this can a plate or some kind of surveyor be used on the machine ?
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Very interesting post.

Lukas Krehel

Very interesting post.

john brooks



Marvelous post. Appreciate it very much.

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